Scan, ATPG and BIST tuned for test coverage without blowing area or timing.
Test coverage, yield and quality are decided at design time, not on the tester. Our DFT team works from architecture through post-silicon support — scan and compression, ATPG pattern generation, memory and boundary-scan BIST — engineered to hit your coverage targets within your area and timing budget.
Flow and methodology defined against your coverage, area and timing constraints.
Hierarchical and flat scan implementation, with and without compression, for small and multi-million-gate designs.
Stuck-at, transition, bridging and cell-aware fault models with coverage analysis at block and SoC level.
MBIST implementation with and without repair, validated across timing and no-timing simulation.
IEEE 1149.1 and 1149.6 compliant boundary-scan implementation at SoC level.
DFX validation at RTL and gate level, plus ATE bring-up and test program support.
In-field monitors and test hooks that extend coverage from the tester into the product's operating life.
Share your spec, node, and timeline — we'll scope exactly what it takes.