BACK-END · PD

Physical Design

Floorplan, place and route tuned to the PPA targets your product actually needs.

Chip design visualization representing Physical Design services

Physical design is where architectural intent either survives contact with silicon or doesn't. We take your netlist through floorplanning, placement, clock tree synthesis and routing with your specific power, performance and area targets driving every decision — not generic default flows.

Netlist In
Floorplan
Placement & CTS
Routing
Sign-off & Tape-out
Service Offerings

What's included in Physical Design.

01

Floorplanning & Power Planning

Block placement, power grid design and macro planning for routability and IR-drop margin.

02

Placement & Clock Tree Synthesis

Timing-driven placement and low-skew CTS tuned to your frequency targets.

03

Routing & Physical Verification Prep

Detailed routing with DRC-aware optimization ahead of sign-off.

04

Static Timing Analysis & Closure

Multi-corner, multi-mode STA with systematic closure across setup and hold.

05

Power, IR-Drop & EM Analysis

Dynamic and static power analysis with IR-drop and electromigration checks.

06

Sign-off & Tape-out Support

Final timing, power and physical sign-off documentation ready for tape-out.

07

Chiplet & Multi-Die Integration

Floorplanning and interface design for 2.5D/3D advanced packaging and chiplet-to-chiplet integration.

PPA-Driven, Sign-off Ready
PPA-Driven Approach

Every decision driven by performance, power and area.

Performance at Scale

Methodologies that scale across complex SoCs.

Sign-off Quality

Robust verification for first-pass silicon success.

Faster Time to Market

Optimized flows and automation for faster turnaround.

Tape-out Ready

Final documentation ready for hand-off.

Explore other services

Part of the Back-End Implementation flow.

Need Physical Design for your project?

Share your spec, node, and timeline — we'll scope exactly what it takes.